The Fraunhofer IMWS is leading a collaborative project called "InThElekt" to integrate electronic components directly into thermoplastic FRP sandwich structures. The goal is to create lightweight structural components that also house and manage vehicle electronics, reducing complexity and improving reliability. A key challenge being addressed is optimizing the thermal conductivity of these FRP structures to effectively cool the integrated electronics.
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FRP is a composite material created by combining a polymer matrix with strong reinforcing fibers, most commonly glass (GFRP) or carbon (CFRP). This marriage produces a material that is exceptionally lightweight yet incredibly strong, offering a superior strength-to-weight ratio compared to traditional automotive materials like steel and aluminum. The Fraunhofer IMWS is leading a collaborative project
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